<h1>Domestic electronics firm signs four MoUs to boost chip ecosystem with research, cybersecurity, training and advanced packaging</h1> A domestic electronics firm signed four MoUs at a semiconductor conference to bolster India's chip ecosystem: with a national fundamental research institute to provide OSAT support for a high-energy physics detector upgrade project; with a cybersecurity company to secure the semiconductor supply chain and protect IP; with an engineering institute to develop industry-aligned curriculum, training and hiring pipelines; and with a packaging-technology firm to offer advanced packaging infrastructure. The agreements aim to drive innovation, workforce development and are projected to generate cumulative revenues of around ?15 crore.