TaxTMI 
TaxTMI 
Effective rate of duty on specified goods of Chapters 70, 84, 85 or 90
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.... insertion into diffusion and oxidation furnaces for production of semi-conductor wafers. 2. 8419 89 or 8486 Chemical vapour deposition apparatus for semi-conductor production. 3. 8419 90 or 8486 Parts of chemical vapour deposition apparatus for semi-conductor production. 4. 8421 19 or 8486 Spin dryers for semi-conductor wafer processing. 5. 8421 91 00 or 8486 Parts of Spin dryers for semi-conductor wafer processing. 6. 8424 89 or 8486 Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process. 7. 8424 89 or 8486 Spraying appliances for etching, stripping or cleaning semi-conductor wafers. 8. 8424 90 00 or 8486 Parts of spraying appliances for etching, stripping or cleaning semi-conductor wafers. 9. 8456 11 00 or 8456 12 00 or 8486 Machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers. 10. 8456 90 10 or 8486 Machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, e....
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....479 89 or 8543 30 00 or 8486 Apparatus for wet-etching, developing, stripping or cleaning semiconductor wafers and flat panel displays. 31. 8479 89 or 8486 Die attach apparatus, tape automated bonders and wire bonders for assembly of semiconductors. 32. 8479 89 or 8486 Machines for bending, folding and straightening semiconductor leads. 33. 8479 89 or 8486 Physical deposition apparatus for semiconductor production. 34. 8479 89 or 8486 Spinners for coating photographic emulsions on semiconductor wafers. 35. 8479 90 or 8486 Parts of apparatus for growing or pulling monocrystal semiconductor boules. 36. 8479 90 or 8486 Parts of epitaxial deposition machines for semiconductor wafers. 37. 8479 90 or 8486 Parts of apparatus for physical deposition by sputtering on semiconductor wafers. 38. 8479 90 or 8486 Parts for die attach apparatus, tape automated bonders and wire bonders for assembly of semiconductors. 39. 8479 90 or 8486 Parts of spinners for coating photographic emulsions on semiconductor wafers. 40. 8479 90 or 8543 90 00 or 8486 Parts of apparatus for wet-etching, developing, stripping or....
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....optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. 60. 9011 90 00 Parts and accessories of photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. 61. 9012 10 Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. 62. 9012 90 00 Parts and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. 63. 9030 90 Parts and accessories of instruments and apparatus and parts of appliances for measuring or checking semiconductor wafers or devices. 64. 9031 41 00 Optical instruments and appliances, for inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices. 65. 9031 49 00 Optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers. 66. 9031 90 00 Parts and acce....
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....ocesses, for dry-etching patterns on semiconductor materials of the said First Schedule. 11. 8486 40 00 Focussed ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices. 12. 8456 90 90 Laser cutters for cutting contacting tracks in semiconductor production by laser beam. 13. 8464.10 Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips. 14. 8464.20 Grinding, polishing and lapping machines for processing of semiconductor wafers. 15. 8464.90 Dicing machines for scribing or scoring semi-conductor wafers. 16. 8466.91 Parts of grinding, polishing and lapping machine for processing of semi-conductor wafer. 17. 8466.91 Parts of machines for sawing monocrystal semi-conductor boules into slices, or wafers into chips. 18. 8466.91 Parts of dicing machines for scribing or scoring semi-conductor wafers. 19. 8466.93 Parts of focussed ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices. 20. 8466.93 Parts of machines for working any material by removal of material, by laser or o....
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.... folding and straightening semiconductor leads. 43. 8479.90 Parts of physical deposition apparatus for semiconductor production. 44. 8480.71 Injection and compression moulds for manufacture of semiconductor devices. 45. 8514.10 Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semi-conductor wafers. 46. 8514.20 Inductance or dielectric furnances and ovens for the manufacture of semi-conductor devices on semi-conductor wafers. 47. 8514.30 Parts of resistance heated furnaces and ovens for the manufacture of semi-conductor devices on semi-conductor wafers. 48. 8514.30 Apparatus for rapid heating of semiconductor wafers. 49. 8514.90 Parts of furnaces and ovens of heading Nos. 8514.10 to 8514.30. 50. 8514.90 Parts of apparatus for rapid heating of wafers. 51 8543 10 10 Ion implanters for doping semiconductor materials. 52. 8543.89 or 9017.20 Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates. 53. 8543.90 Parts of ion implanters for doping semiconductor materials. 54. 8543.90 or 9017.9....