January 6, 2026
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Innodisk launches EXMP-Q911 COM HPC mini module delivering 100 TOPS Edge AI performance with Qualcomm Dragonwing.
Innodisk's EXMP Q911 COM HPC Mini module, powered by Qualcomm Dragonwing IQ 9075, delivers up to 100 TOPS AI inference performance with 36GB LPDDR5X, 128GB UFS 3.1, extended temperature operation ( 40 C to 85 C), and longevity support through 2038; the module includes extensive I/O (PCIe Gen4, USB 3.2, dual 2.5GbE, DP1.2, MIPI CSI 2, CAN FD) and is offered with Innodisk's driver, peripheral integrations, carrier boards, open developer resources (IQ Studio) and cloud management (iCAP) to accelerate industrial edge AI deployment.