Capital goods exemption: substitution adds wafer processing and die/wire bonding equipment to eligible micro-electronic machinery. Amendment to a customs exemption notification substitutes items 24 and 25 in the annexed table to identify specified capital goods for micro-electronic component manufacture. Item 24 is replaced by 'Wafer Scriber or Wafer Slicer or Wafer Sawing Machine or Wafer Fractures or any combination thereof,' and item 25 by 'Die Bonders or Wire Bonders or combination thereof.' The substitution is made by the Central Government under the powers conferred by sub-section (1) of section 25 of the Customs Act, 1962.
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Capital goods exemption: substitution adds wafer processing and die/wire bonding equipment to eligible micro-electronic machinery.
Amendment to a customs exemption notification substitutes items 24 and 25 in the annexed table to identify specified capital goods for micro-electronic component manufacture. Item 24 is replaced by "Wafer Scriber or Wafer Slicer or Wafer Sawing Machine or Wafer Fractures or any combination thereof," and item 25 by "Die Bonders or Wire Bonders or combination thereof." The substitution is made by the Central Government under the powers conferred by sub-section (1) of section 25 of the Customs Act, 1962.
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