<h1>Chinese tech firm plans 2026 and 2027 AI superpods and interconnected superclusters using domestic chips to offset foreign chip limits</h1> A major Chinese technology firm announced plans to deploy large AI computing 'superpods' in 2026 and 2027 and to interconnect them into larger 'superclusters,' relying on domestically produced, less powerful semiconductors and new system architecture to offset limited access to the most advanced foreign chips. The plan aligns with state-driven efforts to reduce reliance on imports amid export restrictions and reported guidance to curb purchases of certain foreign chips. The roadmap includes successive new chip generations through 2028, raising competitive, supply-chain and regulatory considerations as the company seeks parity with leading foreign AI providers.