TaxTMI 
TaxTMI 
Electronic industries raw materials and piece parts for specified end-uses in electronics industry [Chapter 85]
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....namely :- (i) an officer not below the rank of a Joint Director in the Department of Electronics of the Government of India or a Joint Director in the Directorate of Industries of the Government of a State or a Director in the Department of Telecommunications of the Government of India or an Additional Industrial Adviser in the Directorate General of Technical Development of the Government of India, as the case may be, is satisfied that the goods in question are required for the purpose as specified in column (4) of the said Table and recommends grant of the above exemption : Provided that this condition shall not apply in the case of goods imported against supplementary import licences; (ii) the importer shall, by the execution of a bond in such form and for such sum as may be specified by the Assistant Collector of Customs, bind himself to pay, on demand, in respect of such goods as are not proved to the satisfaction of the Assistant Collector of Customs to have been used for the said purpose, an amount equal to the difference between the duty leviable on such goods but for the exemption contained herein and that already paid at the time of importation. TABLE S. No....
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....enes, MOS Grade (xv) Chloroethylene, MOS Grade (xvi) Buffered Oxide Etchant, MOS Grade (xvii) Hydrogen Peroxide (Unstabilised), MOS Grade (xviii) Potassium Hydro-xide Solution, MOS Grade (xix) Crystal, MOS Grade (xx) Isopropyi Alcohol, MOS Grade (xxi) Ammonium Persul-phate, MOS Grade (xxii) Tetra-acetic Acid, MOS Grade (xxiii) Stearic Acid, MOS Grade (xxiv) Ammonium Ci-trate, MOS Grade (xxv) Triammonium Ci-trate, MOS Grade (xxvi) Butyl Carbitol Acetate, MOS Grade Semiconductor Devices 16. 28, 29, 32, 38, 71 Resistive, Conductive, Dielectric, Overglaze or Solder pastes, Composi-tions or inks in packing not exceeding 5 kg. Hybrid Microcircuits, Poten­tiometers, Ceramic and Mica Capacitors, Conductive Rub­ber Switches/Key-boards, Printed Components, Resis­tors other than heating resistors 17. 32 Solder Mask/Resist in ink or film form, with or without associated cata­lysts Printed Circuit Boards 18. 39 Polyethylene terephtha-late film with ferro magnetic coating of thickness upto 0.005 inch with magnetic coating 100 to 180 micro inch Floppy diskettes 19. 38, 81 Lithium Niobate Wafers ....
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.... 39 (i) Plain plastic films of thickness 12 microns or below (ii) Metallised plastic films of thickness 12 microns or below Plastic Film Capacitors, Mixed Dielectric Capacitors 40. 39, 69, 73 The following substrates in any form with or without tags : (i) Phenolic/PoIyamide/ SRBP (Synthetic Resin Bonded Paper) Substrates (ii) Enamelled steel substrates (iii) Glass epoxy unclad substrates (iv) Metal clad substrates (v) Ceramic/Alumina substrates Potentiometers, Hybrid microcircuits, Printed components, semiconductor devices 41. 71 Silver alloy strips in coils of width upto 0.434 inches and thickness upto 0.006 inches Relays, connectors, switches 42. 39 (i) Synthetic polyelectro-lyte dispersant (ii) Polyethylene adduct and non-ionic surface acting material (ZUSOPL-AST) lubricant Ferrites 43. 74 Electrolytic tough pitch (ETP) Copper wire and wire rods Lead wire for electronic components, resistors (other than heating resistors), potentiometers, capacitors 44. 74 (i) Solder plated brass strips upto 100 mm width (ii) Silver plated brass strips upto 100 mm width Potentiometers, connectors, switch....
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....iv) Gold wire with phosphorous or antimony doping (v) Base solder (silver, lead, antimony based) (vi) Soft solder (lead, indium, silver based) (vii) Gold tin alloy (viii) Preforms, discs, dots, rings, wafers, plates, reparlitors of the following materials: (a) Aluminium silicon (b) Gold boron (c) Molybdenum (d) Lead-tin solder (e) Silver antimony (f) Gold antimony (g) Silver Lead Indium (h) Silver Lead Antimony (i) Solder (j) Lead Tin (k) Silver-Copper-Indium (l) Silver-Copper- Ger­manium Arsenic (m) Berrylium Oxide Semiconductor devices 55 78 Lead foil Plastic film capacitors 56. 85 Insulated or enamelled copper wire of 45 SWG or finer than 45 SWG Deflection components, Coils and transformers 57. 74, 85 (i) Oxygen-free high conductivity (OFHC) copper wires, bars, rods, angles, shapes and sections, plates, sheets, strips, tubes and pipes (ii) Parts made of oxygen-free high conductivity copper Semiconductor devices, electronic valves and tubes, transistor headers, glass to metal seals, capacitors, resistors (other than heating resistors), Lead frames 58. 28, 38 Carbon powders, c....
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....ays, Hybrid Microcircuits 76. 85 Parts of Transmitting Tubes Transmitting Tubes 77. 70, 85 Parts of Cathode Ray Tubes Cathode Ray Tubes 78. 38 Silicon in the form of undiffused wafers, discs or chips Semiconductor devices 79. 69, 78, 85 (i) Headers (ii) Caps with or without leads (iii) Cans with or without leads (iv) Pins (v) Stud seals (vi) Lead beads (vii) Ceramic beads (viii) Ceramic-glass pac­kages (ix) Cap to Lead Assem­blies (x) Ceramic Pipes (xi) Lead Frames, single or in roll form (xii) Housings (xiii) Brass ring Semiconductor devices, Resistors (other than Heating Resistors), Capacitors, Connectors, Hybrid Micro-circuits, Printed components 80. 69, 85 Ceramic Dielectric (Un­coated or coated) Ceramic Capacitors 81. 85 (i) Aluminium Leads (ii) Lead/Tabs/Paddle Tabs Electrolytic Capacitors 82. 92 Sapphire Tips Pick-up Cartridges Stylii 83. 39, 48, 85 (i) Paper/Plastic cones (ii) Dampers or Spiders (iii) Domes or Dust Caps (iv) Flat diaphragms Loudspeakers 84. 74 Glass Epoxy Copper Clad Laminates Printed Circuit....
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....assembly or parts thereof (iv) Mechanical speed governor assembly or parts thereof DC Micromotors of voltage rating upto 13.5 volts and not exceeding 20 watts rating 100. 85 Resistor elements/chips with TCR 5 ppm per degree centigrade Chip Resistors/Bulk Metal Film Resistors or Bulk Metal Resistors 101. 28 Selenium Rectifier Plates of Grade E-25 Selenium TV Rectifiers 102. 74, 85 Rayon or Silk cover Litz wire in the following sizes, namely :- (i) 24 (strands) x 0.03 mm (diameter of each strand) (ii) 12 (strands) x 0.03 mm (diameter of each strand) (iii) 9 (strands) x 0.04 mm (diameter of each strand) (iv) 6 (strands) x 0.04 mm (diameter of each strand) (v) 8 (strands) x 0.03 mm (diameter of each strand) (vi) 6 (strands) x 0.03 mm (diameter of each strand) RF/IF Coils or transformers 103. 74 Phosphor Bronze wire nettings (60 mesh or above) Cones, Spiders, Dust Caps for Loudspeakers 104. 28, 29 (i) Electroless Nickel salts/solutions (ii) Sodium Hypophos-phite Glass to metal seals, Lead frames 105. 74 Copper foils (plain or adhesive coated) Copper clad laminates of phenolic or glass epox....
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....ubing, Film or ring Capacitors, semiconductor devices, DC Micromotors, relays, deflection compo-nents 123. 39 Splicing tape Magnetic tape cassettes 124. 39, 48 Insulating/taping material (including pocket carrier tape) in tape, roll or strip form with or without adhesives Capacitors, deflection components, resistors (other than heating resistors), printed circuit boards, potentiometers, semiconduc-tor devices, Inductors. 125. 85, 84, 58, 69 (i) Silicon carbide heating elements (ii) Super Kanthal heating elements (iii) Silicon carbide rollers (iv) Inconel steel rollers (v) Conveying trays (vi) TP Furnace and trays (vii) Saggers Ferrites, ceramic capacitors, potentiometers, semiconduc-tor devices 126. 28, 34, 39, 48, 61, 68, 70, 82, 84, 85 (a) Mica and Micualex washers (b) Parts of doping systems (c) Plastic Film for wafer dicing (d) Sputtor targets (e) Etch disc (f) Film Template (g) Special Gases Semiconductor devices, silicon in all forms, Hybrid Microcircuits (i) Hydrogen chloride (ii) 100% silane (iii) Ammonia (iv) Dichlorosilane (v) Argon (vi) Etch ....