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    <title>Govt approves four chip plants, including an Intel-backed unit, in 3 states</title>
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    <description>Union Cabinet approval was granted for four semiconductor projects across three states, specifying investors, investment amounts, annual production capacities, and projected operational timelines. The sanctioned projects include a 3D Glass semiconductor packaging unit backed by multinational partners, an integrated silicon carbide compound fabrication plant, a chip packaging facility established via a technical partnership, and an electronics component manufacturing unit. The approvals aim to boost domestic component share, introduce advanced packaging and SiC fabrication technologies for defence and commercial applications, and align with national talent-development and research initiatives.</description>
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    <pubDate>Tue, 12 Aug 2025 21:01:04 +0530</pubDate>
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